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一种D2D环境下基于深度强化学习的交接卸载方法及装置

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  • Affilication of Author(s):自动化学院

  • Type of Patent:发明

  • State of Patent:专利申请

  • Authorization number:202210540150.6

  • Service Invention or Not:no

  • First Author:郭祥贵

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