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National Key R&D Program of China, “Study on measurement and evaluation technology of heat transfer energy efficiency in data center parks”, ￥2,000,000，2023.11.1-2026.10.31(PI).

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Date of Project Completion:2026-10-31
Date of Project Initiation:2023-11-01

Pre One:国家自然科学基金面上项目, “面向倒装Chip应用的碳纳米管电-热-力特性多物理场耦合机制”(No. 52476052), 48万元, 2025.1.1-2028.12.31（主持）

Next One:Excellent Youth Team Cultivation Project for the Central Universities of the Ministry of Education, “Enhanced mechanism of chip microscale interface heat transfer and development of carbon-based thermal interface materials”, ￥800,000, 2023.1.1-2024.12.31(PI).

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