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国家自然科学基金面上项目, “面向倒装Chip应用的碳纳米管电-热-力特性多物理场耦合机制”(No. 52476052), 48万元, 2025.1.1-2028.12.31（主持）

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Next One:National Key R&D Program of China, “Study on measurement and evaluation technology of heat transfer energy efficiency in data center parks”, ￥2,000,000，2023.11.1-2026.10.31(PI).

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