Excellent Youth Team Cultivation Project for the Central Universities of the Ministry of Education, “Enhanced mechanism of chip microscale interface heat transfer and development of carbon-based thermal interface materials”, ￥800,000, 2023.1.1-2024.12.31(PI).
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Pre One:National Key R&D Program of China, “Study on measurement and evaluation technology of heat transfer energy efficiency in data center parks”, ￥2,000,000，2023.11.1-2026.10.31(PI).
Next One:Fundamental Research Funds for the Central Universities, “Synergistic mechanism of low impedance and strong heat transfer of multifunctional nano thermal interface materials”,,￥1,700,000, 2022.11.1-2025.10.31(PI).
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