Fundamental Research Funds for the Central Universities, “Synergistic mechanism of low impedance and strong heat transfer of multifunctional nano thermal interface materials”,,¥1,700,000, 2022.11.1-2025.10.31(PI).
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Pre One:Excellent Youth Team Cultivation Project for the Central Universities of the Ministry of Education, “Enhanced mechanism of chip microscale interface heat transfer and development of carbon-based thermal interface materials”, ¥800,000, 2023.1.1-2024.12.31(PI).
Next One:Interdisciplinary Research Project for Beijing Nova Program, “Development and packaging of thermal interface materials for high performance GaN semiconductor lasers”, ¥250,000, 2021.11.14-2024.10.31(PI).