Qiulin
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- Professional Title:Professor
Supervisor of Doctorate Candidates
Alma Mater:Graguate School of Chinese Academy of Sciences
Discipline:Thermal Engineering
School/Department:School of Energy and Environmental Engineering
Business Address:Office 1107, Jidian Building, University of Science and Technology Beijing

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- Scientific Research
Research Field
Paper Publications
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- Yichuan He#,Lin Qiu#*,Jingyi Lu,Dawei Tang,Yanhui Feng*.Molecular insights into phase transition properties on 2-D sinusoidal rough interface.International Journal of Thermal Sciences,2025,219,110248.
- Lin Qiu*,Haimo Li,Zhaoyi Wang,Yijie Yang,Godson Asirvatham Lazarus,Yiming Chen,Yanhui Feng*.Pathways to decarbonizing buildings: Harnessing energy efficiency and sustainable technologies..Thermal Science and Engineering Progress,2025,66,103991.
- Lin Qiu*,Haimo Li,Yanhui Feng*.A weldable graphene foam with wide tuning ranges and high switch ratios.Matter,2025,8(8):102256.
- Lin Qiu*,Xin Wang,Guangpeng Feng,Yanhui Feng*.Tailorable thermal conduction and thermal energy storage behaviors in 3D printed hierarchical cellular structure-based phase change materials.Small Methods,2025,9(7):2402089.
- Lin Qiu*,Zhaoyi Wang,Zihan Liu,Haimo Li,Yanhui Feng*.Nanopore Confinement-driven Synchronous Enhancement of Thermal and Mechanical Properties of Phase Change Materials.Angewandte Chemie International Edition,2025,64(21):e202500957.
Patents
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- Lin Qiu, Yuxin Ouyang, Yanhui Feng, Xinxin Zhang, "A non-destructive testing device and method for three-dimensional anisotropic thermal conductivity of materials"- C.N Patent 201811216992.6, Awarded 2024/04/19.(Invention)
- Lin Qiu, Yuhao Ma, Yanhui Feng, Yuxin Ouyang, “3ω method-based automatic measurement program software for laboratory use (Version No. 1.0)” - C.N. Computer Software Copyright 2022SR0737642, Awarded 2022/1/5.
- Lin Qiu, Kening Yan, Yanhui Feng, Xinxin Zhang. "A device and method for measuring the thermal conductivity of materials in a wide temperature range" - C.N. Patent 202110134103.7, Awarded 2021/10/22. (Invention)
- Lin Qiu, Yuxin Ouyang, Yanhui Feng Xinxin Zhang. “Non-destructive Measuring Device for Three-Dimensional Anisotropic Thermal Conductivity of Materials” - C.N. Patent 201821692160.7, Awarded 2019/5/31.
- Lin Qiu, Dawei Tang, Yanhui Feng, Xinxin Zhang, “Device and Method for On-site Accurate Testing of Heat Conductivity of Energy-saving Thermal Insulation Materials” - C.N. Patent 201610580315.7, Awarded 2018/9/14. (Invention)
Published Books
- Lin Qiu,Yanhui Feng,Thermal Engineering -- Engineering Thermodynamics and Heat Transfer[Teaching material].Beijing,Science Press,2025
- Lin Qiu,Yanhui Feng,Thermal Engineering: Engineering Thermodynamics and Heat Transfer[Teaching material].Germany,De Gruyter,2024
- Lin Qiu,Yanhui Feng,Micro and Nano Thermal Transport: Characterization, Measurement, and Mechanism,London,Academic Press,2022
- Lin Qiu,Xinghua Zheng,Meng Liu,Peng Yue,Dawei Tang,“Chapter 4: Heat Conduction and Heat Storage Characterizations of Phase-Change Microcapsules.” Phase Change Materials: Characteristics, Industrial Applications and Energy Implications[Monograph].New York,Nova Science Publisher,2015
- XinghuaZheng,Jie Zhu,Lin Qiu,Dawei Tang,"Chapter 2: Characterization of Thermophysical Properties of Micro/Nano Structure Materials." Thermal Energy Control Micro/Nano Structure Materials[Monograph].Beijing,Science Press,2014
Research Projects
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- Interdisciplinary Research Project for Beijing Nova Program, "Non-invasive Breast Cancer Screening Application Based on Skin-wearable Deep-layer Temperature Sensors" (No. 20250484954), ¥250,000, 2025.6.25-2027.6.30 (PI),
- Project of the National Natural Science Foundation of China, "Coupling Mechanism of electrothermal-mechanical Characteristics of Carbon nanotubes for flip Chip Application" (No. 52476052), ¥480,000 , 2025.1.1-2028.12.31 (PI),
- National Key R&D Program of China, “Study on measurement and evaluation technology of heat transfer energy efficiency in data center parks”, ¥2,000,000,2023.11.1-2026.10.31(PI).,
- Excellent Youth Team Cultivation Project for the Central Universities of the Ministry of Education, “Enhanced mechanism of chip microscale interface heat transfer and development of carbon-based thermal interface materials”, ¥800,000, 2023.1.1-2024.12.31(PI).,
- Fundamental Research Funds for the Central Universities, “Synergistic mechanism of low impedance and strong heat transfer of multifunctional nano thermal interface materials”,,¥1,700,000, 2022.11.1-2025.10.31(PI).,