Qiulin
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- Professional Title:Professor
Supervisor of Doctorate Candidates
Alma Mater:Graguate School of Chinese Academy of Sciences
Discipline:Thermal Engineering
School/Department:School of Energy and Environmental Engineering
Business Address:Office 1107, Jidian Building, University of Science and Technology Beijing
Contact Information
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- Scientific Research
Research Field
Paper Publications
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- Lin Qiu*,Zhaoyi Wang,Zihan Liu,Haimo Li,Yanhui Feng*.Nanopore Confinement-driven Synchronous Enhancement of Thermal and Mechanical Properties of Phase Change Materials.Angewandte Chemie International Edition,2025,64(21):e202500957.
- Xiangyu Song#,Lei Xu#,Longsong Li#,Xiangyu Meng,Yuening Wang,Lin Qiu*,Yue Hu,Mingjian Zhang,Lingchao Xiang,Guangcheng Xi,Aiguo Wu*,Xiaotian Wang*,Jie Lin*.Amorphous/crystalline urchin-like TiO2 SERS platform for selective recognition and efficient identification of glutathione.Small,2025,21(13):2409400.
- Xiangyu Meng,Yuening Wang,Xiaoyu Song,Yue Liu,Yujiao Xie,Lei Xu,Jian Yu*,Lin Qiu*,Xiaotian Wang*,Jie Lin*.Application and development of SERS technology in detection of VOC gases.Mater. Chem. Front,2024,9:349-366.
- Lin Qiu*,Haimo Li,Xiaolu Yuan,Fengcheng Li,Yanhui Feng*,Chengming Li,Jinlong Liu*,Xiaohua Zhang*.Ultra-Efficient Heat Transport Across a “2.5D” All-Carbon sp2/sp3 Hybrid Interface.Angewandte Chemie,2025,64(6):e202417902.
- Kening Yan#,Lin Qiu#*,Haimo Li,Ning Cao,Yanhui Feng*.Expanded graphite encapsulation of nitrates for enhanced thermal transport: Mechanism insight and component screening.Composites Science and Technology,2025,259:110957.
Patents
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- Lin Qiu, Yuxin Ouyang, Yanhui Feng, Xinxin Zhang, "A non-destructive testing device and method for three-dimensional anisotropic thermal conductivity of materials"- C.N Patent 201811216992.6, Awarded 2024/04/19.(Invention)
- Lin Qiu, Yuhao Ma, Yanhui Feng, Yuxin Ouyang, “3ω method-based automatic measurement program software for laboratory use (Version No. 1.0)” - C.N. Computer Software Copyright 2022SR0737642, Awarded 2022/1/5.
- Lin Qiu, Kening Yan, Yanhui Feng, Xinxin Zhang. "A device and method for measuring the thermal conductivity of materials in a wide temperature range" - C.N. Patent 202110134103.7, Awarded 2021/10/22. (Invention)
- Lin Qiu, Yuxin Ouyang, Yanhui Feng Xinxin Zhang. “Non-destructive Measuring Device for Three-Dimensional Anisotropic Thermal Conductivity of Materials” - C.N. Patent 201821692160.7, Awarded 2019/5/31.
- Lin Qiu, Dawei Tang, Yanhui Feng, Xinxin Zhang, “Device and Method for On-site Accurate Testing of Heat Conductivity of Energy-saving Thermal Insulation Materials” - C.N. Patent 201610580315.7, Awarded 2018/9/14. (Invention)
Published Books
- Lin Qiu,Yanhui Feng,Thermal Engineering -- Engineering Thermodynamics and Heat Transfer[Teaching material].Beijing,Science Press,2025
- Lin Qiu,Yanhui Feng,Thermal Engineering: Engineering Thermodynamics and Heat Transfer[Teaching material].Germany,De Gruyter,2024
- Lin Qiu,Yanhui Feng,Micro and Nano Thermal Transport: Characterization, Measurement, and Mechanism,London,Academic Press,2022
- Lin Qiu,Xinghua Zheng,Meng Liu,Peng Yue,Dawei Tang,“Chapter 4: Heat Conduction and Heat Storage Characterizations of Phase-Change Microcapsules.” Phase Change Materials: Characteristics, Industrial Applications and Energy Implications[Monograph].New York,Nova Science Publisher,2015
- XinghuaZheng,Jie Zhu,Lin Qiu,Dawei Tang,"Chapter 2: Characterization of Thermophysical Properties of Micro/Nano Structure Materials." Thermal Energy Control Micro/Nano Structure Materials[Monograph].Beijing,Science Press,2014
Research Projects
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- Project of the National Natural Science Foundation of China, "Coupling Mechanism of electrothermal-mechanical Characteristics of Carbon nanotubes for flip Chip Application" (No. 52476052), ￥480,000 , 2025.1.1-2028.12.31 (PI),
- National Key R&D Program of China, “Study on measurement and evaluation technology of heat transfer energy efficiency in data center parks”, ￥2,000,000，2023.11.1-2026.10.31(PI).,
- Excellent Youth Team Cultivation Project for the Central Universities of the Ministry of Education, “Enhanced mechanism of chip microscale interface heat transfer and development of carbon-based thermal interface materials”, ￥800,000, 2023.1.1-2024.12.31(PI).,
- Fundamental Research Funds for the Central Universities, “Synergistic mechanism of low impedance and strong heat transfer of multifunctional nano thermal interface materials”,,￥1,700,000, 2022.11.1-2025.10.31(PI).,
- Interdisciplinary Research Project for Beijing Nova Program, “Development and packaging of thermal interface materials for high performance GaN semiconductor lasers”, ￥250,000, 2021.11.14-2024.10.31(PI).,