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Patents
[1]一种工业级多功能膏体充填试验平台及测试方法，ZL202010085295.2.（排名第四）
[2]一种环管试验系统基准零点的确定方法，ZL202010110169.8. （排名第四）
[3]Deep cone thickener with underflow concentration rapid auto-adjustment，US10864463B2. （排名第三）
[4]一种底流浓度快速自调控的深锥浓密机，ZL201810272655.2. （排名第三）
[5]底流浓度自适应调控的膏体浓密机及精准监测与调控方法，ZL201810332168.0. （排名第二）
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