L.H. Wang, J.W. Li, M. Catalano, G.Z. Bai, N. Li, J.J. Dai, X.T. Wang, H.L. Zhang, J.G. Wang, M.J. Kim: Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer, Composites Part A, 113 (2018) 76-82
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Pre One:Z.F. Che, J.W. Li, Q.X. Wang, L.H. Wang, H.L. Zhang, Y. Zhang, X.T. Wang, J.G. Wang, M.J. Kim: The formation of atomic-level interfacial layer and its effect on thermal conductivity of W-coated diamond particles reinforced Al matrix composites, Composites Part A, 107 (2018) 164-170
Next One:L.H. Wang, J.W. Li, M. Catalano, G.Z. Bai, N. Li, J.J. Dai, X.T. Wang, H.L. Zhang, J.G. Wang, M.J. Kim: Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer, Composites Part A, 113 (2018) 76-82
