L.H. Wang, J.W. Li, M. Catalano, G.Z. Bai, N. Li, J.J. Dai, X.T. Wang, H.L. Zhang, J.G. Wang, M.J. Kim: Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer, Composites Part A, 113 (2018) 76-82
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Pre One:L.H. Wang, J.W. Li, M. Catalano, G.Z. Bai, N. Li, J.J. Dai, X.T. Wang, H.L. Zhang, J.G. Wang, M.J. Kim: Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer, Composites Part A, 113 (2018) 76-82
Next One:G. Chang, F.Y. Sun, L.H. Wang, Z.X. Che, X.T. Wang, J.G. Wang, M.J. Kim, H.L. Zhang: Regulated interfacial thermal conductance between Cu and diamond by a TiC interlayer for thermal management applications, ACS Applied Materials & Interfaces, 11 (2019) 26507-26517
