张文井
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- Professional Title:Associate Professor
Supervisor of Master's Candidates
Discipline:Materials Science
Materials Processing Engineering
Degree:博士
School/Department:材料科学与工程学院
Contact Information
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- PostalAddress:
- Email:
- Paper Publications
Grain boundary topology engineering enables crack-free additive manufacturing of tungsten
Release time:2026-06-01 Hits:
- Impact Factor:24.1
- DOI number:10.1016/j.mattod.2026.103271
- Affiliation of Author(s):清华大学
- Journal:Materials Today
- Co-author:Renguang Liu, Andrew Godfrey, Yiming Niu, Shuyan Zhong, Menghan Ma, Yubin Lan, Jinhan Chen, Kailun Li, Wenjing Zhang, Wei Liu, Xiaoxu Huang, Huajian Gao
- First Author:Mingshen Li
- Indexed by:Journal paper
- Correspondence Author:Renguang Liu, Wei Liu, Xiaoxu Huang, Huajian Gao
- Document Code:103271
- Discipline:Engineering
- First-Level Discipline:Materials Science and Engineering
- Document Type:J
- Volume:95
- Page Number:103271
- ISSN No.:1369-7021
- Translation or Not:no
- Date of Publication:2026-06-01
