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Pre One:Z. Fan, H. Wang, Y. Wu*, X. J. Liu, Z. P. Lu, Thermoelectric high-entropy alloys with low lattice thermal conductivity, RSC Advances. 2016, 6(57): 52164-52170.
Next One:H. Wang, X. M. Chu, Y. Wu*, X. J. Liu, Z. P. Lu, Mold-filling Ability of Aluminum Alloy Melt during the Two-step Foaming Process. Journal of Materials Science & Technology. 2016, 32: 509-514.