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Wu Mao, Qu Xuanhui, He Xinbo, Rafi-ud-din, Ren Shubin, Qin Mingli. Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) on SiCp/Al composites. Transactions of Nonferrous Metals Society of China, 2010, 20(6): 958-965.
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上一条：Wu Mao, He Xinbo, Rafi-ud-din, Ren Shubin, Qin Mingli, Qu Xuanhui. Effect of P and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni/Ni(P) solder joints. Materials Chemistry and Physics, 2010, 121(1-2): 259-266.
下一条：Wu Mao, Chang Lingling, Peng Zirong, Yong Weina, Feng Zelong, Wang Wei, He Xinbo, Qu Xuanhui. Investigation of Al-based alloys for brazing SiCp/Al composites. Rare Metal Materials and Engineering, 2011, 40(s3): 132-135.