Xiaokui
|
Supervisor of Doctorate Candidates
Alma Mater:北京科技大学
Discipline:Materials Science
School/Department:新材料技术研究院
Contact Information
No content
- Paper Publications
Xiao Kui,Yi Pan, Dong Chaofang,et al. Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards, MATERIALS LETTERS, 2018, 210(5):283-286.
Release time:2022-04-13 Hits:
- Translation or Not:no
