Evaluation of K3Fe(CN)6 on deposition behavior and structure of electroless copper plating

Journal:Electrochemistry

Co-author:Xiaomei Deng,Jianhei Yan,Jimmy Yun

First Author:Jianhong Lu

Indexed by:Journal paper

Correspondence Author:Mingyong Wang,Shuqiang Jiao

Volume:87,

Page Number:214-219

Translation or Not:no

Date of Publication:2019-01-01

Included Journals:SCI