吴茂，何新波，任淑彬，曲选辉. 一种铝碳化硅封装外壳的封接方法. 专利号：ZL200810114098. 8.
Date:2022-04-13 clicks:
Service Invention or Not:no
Faculty
Master Tutor
Name (English):Wumai
Name (Pinyin):wumao
School/Department:新材料技术研究院
Education Level:研究生
Degree:博士
Professional Title:Associate Research Fellow（Nature Science）
Alma Mater:北京科技大学
Discipline:
Materials Science
Service Invention or Not:no