Wu Mao, He Xinbo, Rafi-ud-din, Ren Shubin, Qin Mingli, Qu Xuanhui. Effect of P and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni/Ni(P) solder joints. Materials Chemistry and Physics, 2010, 121(1-2): 259-266.

Date:2022-04-13 clicks:

Translation or Not:no

Pre One:Wu Mao, He Xinbo, Rafi-ud-din, Ren Shubin, Qin Mingli, Qu Xuanhui. Effect of various Ni plating layers and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni solder joint. Surface and Coatings Technology, 2009, 203(20-21): 3011-3018. Next One:Wu Mao, Qu Xuanhui, He Xinbo, Rafi-ud-din, Ren Shubin, Qin Mingli. Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) on SiCp/Al composites. Transactions of Nonferrous Metals Society of China, 2010, 20(6): 958-965.