中文

Enhancing interfacial thermal transport efficiently in diamond/graphene heterostructure by involving vacancy defects

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  • Impact Factor:8.7

  • DOI number:10.1016/j.compositesa.2024.108008

  • Journal:Composites Part A: Applied Science and Manufacturing

  • Co-author:Ziyang Wang,Haimo Li,Yanhui Feng*

  • First Author:Yiling Liu#,Lin Qiu#*

  • Indexed by:Journal paper

  • Correspondence Author:Lin Qiu,Yanhui Feng

  • Volume:178:

  • Page Number:108008

  • Translation or Not:no

  • Date of Publication:2024-01-01

  • Included Journals:SCI

  • Links to published journals:https://www.sciencedirect.com/science/article/pii/S1359835X24000058


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