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Study on the thermal resistance in secondary particles chain of silica aerogel by molecular dynamics simulation

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Impact Factor:2.183
DOI number:10.1063/1.4894511
Journal:Journal of Applied Physics
Co-author:Lin Qiu*,Xinghua Zheng*,Jie Zhu,Dawei Tang
First Author:Meng Liu
Indexed by:Journal paper
Correspondence Author:Lin Qiu,Xinghua Zheng
Document Code:093503
Volume:116
Issue:9
Page Number:093503
Translation or Not:no
Date of Publication:2014-01-01
Included Journals:SCI
Links to published journals:https://pubs.aip.org/aip/jap/article/116/9/093503/689006/Study-on-the-thermal-resistance-in-secondary

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