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Xiaowen Peng, Leng Chen*. Interdiffusion phenomena and magnetic properties of deposited Co/Cu/Co trilayers on silicon wafers. Science of Advanced Materials, 2018,10:1327-1331

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Next One:Xiaowen Peng, Leng Chen*. Effect of high entropy alloys TiVCrZrHf barrier layer on microstructure and texture of Cu thin films. Materials Letters, 2018,230:5-8

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