肖葵
个人信息Personal Information
教师英文名称:Xiaokui
职称:研究员
博士生导师
毕业院校:北京科技大学
学科:材料学
学历:研究生
学位:博士
所在单位:新材料技术研究院
主要任职:国家材料腐蚀与防护科学数据中心副主任
电子邮箱:
办公地点:腐蚀楼522
Xiao Kui,Yi Pan, Dong Chaofang,et al. Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards, MATERIALS LETTERS, 2018, 210(5):283-286.
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上一条:Wei Xue, Zhaoliang Li, Kui Xiao⁎,et al.Initial microzonal corrosion mechanism of inclusions associated with the precipitated (Ti, Nb)N phase of Sb-containing weathering steel,Corrosion Science,2020,163:108232-108241.
下一条:Xiao Kui,Gao Xiong,Yan Lidan,et al. Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference. CHEMICAL ENGINEERING JOURNAL, 2018, 336(3): 92-101