|
个人信息Personal Information
教师英文名称：Xiaokui
职称：研究员（自然科学）
博士生导师
毕业院校：北京科技大学
学科：材料学
学历：研究生
学位：博士
所在单位：新材料技术研究院
Xiao Kui，Yi Pan, Dong Chaofang，et al. Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards, MATERIALS LETTERS, 2018, 210(5):283-286.
点击次数：
是否译文：否
上一条：Wei Xue, Zhaoliang Li, Kui Xiao⁎，et al.Initial microzonal corrosion mechanism of inclusions associated with the precipitated (Ti, Nb)N phase of Sb-containing weathering steel，Corrosion Science，2020，163：108232-108241.
下一条：Xiao Kui，Gao Xiong，Yan Lidan，et al. Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference. CHEMICAL ENGINEERING JOURNAL, 2018, 336(3): 92-101