Y.F. Liang, Y.T. Zheng*, J.J. Wei*, et al. Effect of grain boundary on polycrystalline diamond polishing by high-speed dynamic friction [J]. Diamond and Related Materials, 2021, 117: 108461.

Date:2022-04-13 clicks:

Translation or Not:no

Pre One:X. Jia, J.J. Wei*, Y.B. Huang, et al. Fabrication of low stress GaN-on-diamond structure via dual-sided diamond film deposition[J]. Journal of Materials Science, 2021, 56: 6903-6911. Next One:X.B. Yan, J.J. Wei*, K. An, et al. Graphitization of CVD diamond grain boundaries during transient heat treatment [J]. Diamond and Related Materials, 2021, 116: 108433.