X.Y. Liu, F.Y. Sun, L.H. Wang, Z.X. Wu, X.T. Wang, J.G. Wang, M.J. Kim, H.L. Zhang: The role of Cr interlayer in determining interfacial thermal conductance between Cu and diamond, Applied Surface Science, 515 (2020) 146046
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Pre One:G. Chang, F.Y. Sun, L.H. Wang, Z.X. Che, X.T. Wang, J.G. Wang, M.J. Kim, H.L. Zhang: Regulated interfacial thermal conductance between Cu and diamond by a TiC interlayer for thermal management applications, ACS Applied Materials & Interfaces, 11 (2019) 26507-26517
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