李成明
个人信息
Personal information
教师英文名称：Lichengming
职称：研究员（自然科学）
博士生导师
毕业院校：北京科技大学
学科：材料学
学历：研究生
学位：博士
所在单位：新材料技术研究院
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- [11] XiaoluYuan, JiangweiLiu*, SiwuShao, JinlongLiu, JunjunWei, BoDa, Chengming Li*, YasuoKoide. Thermal stability investigation for Ohmic contact properties of Pt, Au, and Pd electrodes on the same hydrogen-terminated diamond，AIP Advances, 2020, 10(5): 055114..
- [12] Zheng Yuting, Zhang Rui, Chen Xiaodong, Hing Peter, Liu Jinlong, Wei Junjun, Wang Jue, Li Chengming*, Ye Haitao*. Doomed couple of diamond with terahertz frequency: hyperfine quality discrimination and complex dielectric responses of diamond in terahertz waveband. ACS Applied Electronic Materials, 2020, 2(5): 1459–1469.
- [13] Zheng Yuting, Liu Jinlong, Zhang Ruoying, Cumont Aude, Wang Jue, Wei Junjun, Li Chengming*, Ye Haitao*. Fast smoothing on diamond surface by inductively coupled plasma reactive ion etching. Journal of Materials Research. 2020, 35: 462-472..
- [14] Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..
- [15] Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..
- [16] Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..
- [17] Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..
- [18] Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..
- [19] Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..
- [20] Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..