XiaoluYuan, JiangweiLiu*, SiwuShao, JinlongLiu, JunjunWei, BoDa, Chengming Li*, YasuoKoide. Thermal stability investigation for Ohmic contact properties of Pt, Au, and Pd electrodes on the same hydrogen-terminated diamond，AIP Advances, 2020, 10(5): 055114..

Zheng Yuting, Zhang Rui, Chen Xiaodong, Hing Peter, Liu Jinlong, Wei Junjun, Wang Jue, Li Chengming*, Ye Haitao*. Doomed couple of diamond with terahertz frequency: hyperfine quality discrimination and complex dielectric responses of diamond in terahertz waveband. ACS Applied Electronic Materials, 2020, 2(5): 1459–1469.

Zheng Yuting, Liu Jinlong, Zhang Ruoying, Cumont Aude, Wang Jue, Wei Junjun, Li Chengming*, Ye Haitao*. Fast smoothing on diamond surface by inductively coupled plasma reactive ion etching. Journal of Materials Research. 2020, 35: 462-472..

Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..

Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..

Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..

Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..

Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..

Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..

Zheng Yuting, Ye Haitao*, Thornton Rob, Knott Tom, Ochalski J. Tomasz, Wang Jue, Liu Jinlong, Wei Junjun, Chen Liangxian, Cumont Aude, Zhang Ruoying, Li Chengming*. Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing. Diamond and Related Materials. 2020, 101(1): 107600..