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- ● 【SCI征稿】Electronics 01.15.2026:Wireless Multimodal Communications for Integrated Heterogeneous Networks

URL: https://www.mdpi.com/journal/electronics/special_issues/GXLO2A3LIN


Wireless Multimodal Communications for Integrated Heterogeneous Networks


A special issue of Electronics (ISSN 2079-9292).

Deadline for manuscript submissions: 15 January 2026 | Viewed by 14

Special Issue Editors

Dr. Chao Ren

 

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Guest Editor

School of Computer and Communication Engineering, University of Science and Technology Beijing, Beijing 100083, China
Interests: wireless cooperative communication; multimodal communication; 6G

Dr. Biao Pan

 

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Guest Editor

School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China
Interests: digital integrated circuit design
Special Issues, Collections and Topics in MDPI journals

Dr. Boyang Liu

 

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Guest Editor

School of Communication and Information Engineering, Xi’an University of Posts and Telecommunications, Xi’an 710121,China
Interests: mobile edge computing; integrated sensing and communication; software defined radio; wireless communications

Special Issue Information

Dear Colleagues,

The deep integration of 5G/6G with the digital economy has driven ubiquitous expansion of emerging networks—mobile internet, industrial IoT, satellite internet, vehicular networks, and low-altitude intelligent networks—into space-air-ground-sea domains. To meet the demands of pervasive intelligent IoT in integrated scenarios, communication systems must transcend traditional terrestrial boundaries and establish multidimensional architectures spanning deep space, aerial, terrestrial, and maritime environments. In emerging fields such as smart grid digitization, aerospace vehicle networking, and maritime energy IoT, multimodal communications—integrating radio frequency/optical/acoustic transmission, integrated sensing, communication, and computation (ISAC), and semantic communication—are redefining information exchange paradigms for intelligent power system maintenance, low-altitude traffic management, and marine resource exploitation. Current challenges include cross-domain coordination (e.g., dynamic spectrum adaptation, heterogeneous protocol interoperability, and edge-cloud resource orchestration), necessitating an innovation ecosystem combining self-organizing networks, intelligent coding, edge AI, and hardware acceleration. This work focuses on multimodal communication advancements in vertical domains (e.g., power systems, aerospace, marine development), aiming to advance dynamic reconfiguration of smart grids, space-air-ground intelligent communication control, and autonomous coordination in UAV self-organizing networks. By developing software-defined radio (SDR)-compatible platforms with intelligent reflecting surfaces (IRS) and hybrid multimodal wireless transmission, we accelerate the engineering application of multimodal technologies in strategic areas such as next-generation power systems, low-altitude economy, and deep-space exploration.

Dr. Chao Ren
Dr. Biao Pan
Dr. Boyang Liu
Guest Editors


Manuscript Submission Information


Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


Keywords

  • multimodal networks

  • ISAC integration

  • cross-domain orchestration

  • intelligent reflecting surfaces

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Published Papers

This special issue is now open for submission.

URL: https://www.mdpi.com/journal/electronics/special_issues/GXLO2A3LIN